Unlike most polyurethanes, Eccostock SH has an extremely low dissipation factor and low dielectric constant. It is primarily used as a high temperature structural member or thermal barrier in electrical/electronic applications.
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| Aerospace/Defense | Industrial |
| Automated Pad Placement | Automated Packaging |
| Custom Automation | Custom Product Development |
| Modeling | Prototyping |
| Service | Testing |
| Medical diagnostic | Satellites |
| Coefficient of linear expansion (cm/cm/°c) | 0.00004 |
| Color | Pink |
| Density (g/cc) | 0.03 |
| Dielectric Constant | 1.00 |
| Dielectric strength (Kv/mm) | 1.6 |
| Function | Dielectric |
| Loss Tangent | 0.00100 |
| Operating Temperature Max (Celsius) | 135 |
| Operating Temperature Min (Celsius) | -70 |
| Option Availability - Machining | Yes |
| Option Availability - on drawing | Yes |
| REACH | Yes |
| ROHS Compliant | Yes |
| Resin | Polyurethane |
| Tensile Strength (Mpa) | 0.3 |
| Type | Low Loss rigid dielectric foam |
